BlogNix.
HARDWARE & SILICON LAB

Future Hardware

Inside the world of 1.4nm semiconductors, spatial computing, and the next generation of mobile engineering that will define the late 2020s.

NODE: 1.4NM FINFET YIELD: 89.4% THERMALS: OPTIMIZED BANDWIDTH: 10.2 GBPS STATUS: READY_FOR_MASS_PROD
SEMICONDUCTORS

The 2nm Manufacturing War: TSMC vs. Intel Foundry

The race for silicon supremacy has reached a fever pitch. We analyze the technical challenges of 2nm wafer production and why Apple has already booked 90% of TSMC's 2026 capacity for the iPhone 18 Pro lineup.

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MOBILE ENGINEERING

iPhone 18 Pro: The Blueprint of Spatial Intelligence

Leaked blueprints suggest a complete removal of physical ports in favor of a new "Neural Connector." With a focus on local AI processing, the iPhone 18 Pro is set to be a handheld supercomputer.

READ BLUEPRINTS →
WEARABLES 2.0

Beyond the Screen: The Era of AR Contact Lenses

Spatial computing is moving from headsets to retinal projection. Explore the prototypes that are aiming to replace the smartphone with invisible, always-on augmented reality interfaces.

FUTURE ROADMAP →
QUANTUM HARDWARE

Quantum Supremacy at Room Temperature?

A breakdown of the new nitrogen-vacancy center processors that claim to maintain quantum coherence without the need for liquid helium cooling. This could change consumer tech forever.

READ WHITE PAPER →